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聚酰亞胺樹脂是一種具有高模量、高強度、低吸水率、耐水解、耐輻射，優異絕緣性及耐熱氧化穩定性的工程塑料，在航空航天、電器絕緣、原子能工業、衛星、核潛艇，在塑料成型和微電子方面有廣泛的應用。現有AB混合型一體型聚酰亞胺樹脂產品。粘結層斷裂拉伸強度可達30MPa，成膜后斷裂強度達250MPa。

Polyimide resin is an engineering plastic with high modulus, high strength, low water absorption, resistance to hydrolysis, radiation resistance, excellent insulation and heat resistance and oxidation stability. Existing AB mixed type one - type polyimide resin products. The tensile strength at break of the bond layer can reach 30MPa, and the fracture strength after film formation can reach 250MPa.