粉體行業(yè)在線展覽
bohp
70-80萬(wàn)元
bohp
2936
高純鎘:99.999% Cd-5N-I-7
檢測(cè)雜質(zhì):Ag, Al, Bi, Ca, Cr, Cu, Fe, Mg, Ni,Pb, Sb, Zn, Sn
雜質(zhì)總含量:≤10ppm
高純鎘:99.9999% Cd-6N-I-8
檢測(cè)雜質(zhì):Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb,Sb, Zn, Sn
雜質(zhì)總含量:≤1ppm
高純鎘:99.99999% Cd-7N-I-9
檢測(cè)雜質(zhì):Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb,Sb, Zn
雜質(zhì)總含量:≤0.1ppm
用途:主要用于制備Ⅱ-Ⅵ族化合物半導(dǎo)體、高純合金、電池焊料、核原子反應(yīng)堆中控制棒,太陽(yáng)能電池材料等。
包裝:滌綸薄膜包裝后雙層復(fù)合膜抽真空包裝兩次,外套鋁箔內(nèi)充氬氣封裝或者直接玻璃管真空封裝。
Specification:
High purity Cd: 99.999% Cd-5N-I-7
Testing impurity: Ag, Al, Bi, Ca,Cr, Cu, Fe, Mg, Ni, Pb, Sb, Zn, Sn
Totalimpurity content: ≤10ppm
High purity Cd: 99.9999% Cd-6N-I-8
Testing impurity: Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb, Sb, Zn, Sn
Totalimpurity content: ≤1ppm
Highpurity Cd: 99.99999% Cd-7N-I-9
Testingimpurity: Ag, Al, Bi, Cr, Cu, Fe, Mg, Ni, Pb, Sb, Zn
Totalimpurity content: ≤0.1ppm
Application: Used for preparation Ⅱ-Ⅵ elementschemical compound semiconductor, high purity metal, battery solder and controlrod of atomic reactor. Used as the material of solar cell etc.
Package: Packed with terylene film, anddouble poly-film with vacuum encapsulation, do this twice, then packed withaluminum foil with argon encapsulation, or packed with glass tube with vacuumencapsulation directly.